Resultados da busca para "Deep Reactive-Ion Etching"
a) Traduções técnicas inglês para português
(Substantivo)
◼Sigla em inglêsDRIE (Deep Reactive-Ion Etching)
Meaning
A highly anisotropic etch process used to create deep, steep-sided holes and trenches in wafers, with aspect ratios of 20:1 or more. It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM. (http://en.wikipedia.org...)